JPS6385376U - - Google Patents
Info
- Publication number
- JPS6385376U JPS6385376U JP17682386U JP17682386U JPS6385376U JP S6385376 U JPS6385376 U JP S6385376U JP 17682386 U JP17682386 U JP 17682386U JP 17682386 U JP17682386 U JP 17682386U JP S6385376 U JPS6385376 U JP S6385376U
- Authority
- JP
- Japan
- Prior art keywords
- paste
- solder
- nozzle
- island
- paste solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 235000011837 pasties Nutrition 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17682386U JPS6385376U (en]) | 1986-11-17 | 1986-11-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17682386U JPS6385376U (en]) | 1986-11-17 | 1986-11-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6385376U true JPS6385376U (en]) | 1988-06-03 |
Family
ID=31117444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17682386U Pending JPS6385376U (en]) | 1986-11-17 | 1986-11-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6385376U (en]) |
-
1986
- 1986-11-17 JP JP17682386U patent/JPS6385376U/ja active Pending